Component processing services

Every service ISI provides, from device programming through to counterfeit component testing, in one place. Combine services or run them standalone, all from our Indianapolis facility.

Device Programming

ISI provides IC and device programming for electronics manufacturers across the United States, using silicon-manufacturer-approved algorithms and ESD-controlled handling throughout. Programming is available standalone or combined with our SMD taping and reeling, dry packing, and laser marking services for a complete component finishing solution from one facility.

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SMD Taping & Reeling

ISI provides a professional SMD taping and reeling service for electronics manufacturers across the United States. We handle ICs, capacitors, resistors, and a wide range of other surface-mount components, protecting them against ESD, environmental damage, and transit mishaps by placing them into carrier tape ready for direct pick-and-place line feed.

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Bare Die Tape & Reel

ISI provides bare die tape and reel services for wafer-level CSP, WLCSP, flip chip, and die package devices. We take unpackaged semiconductor die from wafer, film frame, waffle pack, or loose format and place them into EIA-481-D compliant carrier tape, ready for direct SMT line-feed. Available standalone or combined with device programming, laser marking, and dry packing for a complete finishing solution.

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Laser Reballing

ISI provides BGA laser reballing services for OEMs, distributors, and contract electronics manufacturers across the United States. Using precision laser technology, we remove and replace solder balls on Ball Grid Array packages without reflow cycles, preserving component integrity and extending service life. Available standalone or combined with device programming, tape and reel, and dry packing.

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Axial & Radial Taping

ISI has the experience, flexibility, and handling expertise to satisfy virtually any axial or radial taping requirement. We tape and reel a wide range of components including capacitors, resistors, diodes, and springs, with all packaging built to standards that assure compatibility with automated insertion equipment.

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Lead Pre-Forming

ISI provides a comprehensive lead pre-forming service for most active or passive discrete components. Our experience and resources offer a capability with few limitations, achieving cost savings in tooling and higher efficiencies than in-house processing. The service can be performed on components supplied either loose or on tape.

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Laser Marking

ISI operates laser marking capability to meet customer delivery schedules for most IC devices, including SO, PLCC, QFP, and BGA packages. We also laser mark components outside the electronics industry where traceability is essential. Laser marking is often carried out alongside device programming or laser reballing, with alloy conversion available where required.

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Carrier Tape

ISI manufactures a comprehensive range of carrier tapes in-house using premium, high-specification materials. Our automatic thermoforming machines create custom embossed carrier tapes, and our expertise in design, custom tooling, and material manufacturing allows us to produce precisely defined, robust pocket formations, including deep pocket forming, without the long lead times of overseas tape manufacturing.

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Alloy Conversion & Re-Tinning

ISI provides a specialist alloy conversion and re-tinning service for electronic components. We convert lead-free (RoHS) components to tin/lead alloy for high-reliability applications, and restore solderability on components that have been in storage. Our automated hot solder dip process delivers consistent, repeatable results with full traceability.

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Dry Packing

ISI offers a full dry packing service for moisture-sensitive components. Parts are vacuum sealed in moisture barrier bags (MBB), barcoded for traceability, with humidity indicator cards and desiccant sealed inside to show the condition of the parts at point of use. Components exposed to air beyond guideline limits can be re-baked and vacuum sealed to restore them to a usable condition.

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SMD Consumables

In addition to our full range of processing services, ISI supplies a complete range of consumables for axial and radial taping and SMD taping lines, including carrier tapes, adhesive taping, anti-static bags, interleaf tape, and splicing labels, all available from stock with fast dispatch.

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Counterfeit Testing

Counterfeit electronic components are one of the most serious threats facing today's supply chains. From re-marked ICs to cloned semiconductors, substandard parts entering production cause field failures, costly recalls, and in safety-critical applications, far worse. ISI provides counterfeit component detection and authenticity testing for electronics manufacturers, distributors, and procurement teams, combining multiple inspection techniques to identify fake, re-marked, or reclaimed components before they enter production.

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OEM Project Support

If you would like your electronic assembly production supported by on-site programming for a short project or an ongoing basis, ISI has options available that require little or no capital investment on your part. Automated machinery for programming, SMD taping, axial and radial processing, laser marking, cropping, and forming can be brought to your facility, supplied with experienced operators who can quickly get the cell running.

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Have a print, sketch, or spec ready?

Get in touch and our engineering team will get a quote back to you, usually within 24 hours.

Email us Call (317) 631-7980