ISI provides a specialist alloy conversion and re-tinning service for electronic components. We convert lead-free (RoHS) components to tin/lead alloy for high-reliability applications, and restore solderability on components that have been in storage. Our automated hot solder dip process delivers consistent, repeatable results with full traceability.
Lead-free components converted to tin/lead (SnPb) alloy for assemblies operating under RoHS exemptions.
Legacy SnPb components converted to SAC305 or other lead-free alloys for commercial lines requiring RoHS compliance.
Components that have suffered oxidation or alloy degradation in storage can be re-tinned to restore solderability.
Converting pure-tin finishes to a tin/lead alloy eliminates the risk of tin whisker growth entirely.
Gold-plated leads stripped and re-coated with a fresh alloy to prevent gold embrittlement at the solder joint.
Small passives including 0402 resistors and capacitors processed alongside larger QFP, TSOP, SOIC, and DIP packages.
A controlled, multi-stage process eliminates operator variability and thermal shock risk.
Certificate of conformance issued for every lot processed, with complete process records available.
Alloy conversion carried out alongside programming and taping on one site, one point of contact for the complete preparation workflow.
A full assembly bill of materials can be converted in one pass, avoiding mixed-alloy joint risk across the board.
Alloy conversion refers to changing the solder alloy on component leads from one specification to another, for example lead-free SAC305 to tin/lead SnPb. Re-tinning is the broader term that also includes refreshing oxidized or degraded tin finishes to restore solderability. Both use the same automated hot solder dip method.
Yes. This is one of our most common requests. RoHS-compliant lead-free components can be converted to tin/lead alloy to meet the requirements of high-reliability assemblies operating under RoHS exemptions.
Yes. Our automated process handles small passives including 0402 resistors and capacitors, as well as larger devices such as QFP, TSOP, SOIC, and DIP packages.
Get in touch and our engineering team will get a quote back to you, usually within 24 hours.