ISI provides BGA laser reballing services for OEMs, distributors, and contract electronics manufacturers across the United States. Using precision laser technology, we remove and replace solder balls on Ball Grid Array packages without reflow cycles, preserving component integrity and extending service life. Available standalone or combined with device programming, tape and reel, and dry packing.
Full BGA, micro-BGA, CSP, flip-chip, and LGA components handled with precision tooling.
Lead-free (SAC305) and leaded (SnPb) solder ball replacement available to customer specification.
Fine-pitch BGA down to 0.4mm, suitable for high-density PCB assemblies.
All reballing carried out in line with IPC-7711/7721 rework and repair guidance.
Complete lot documentation provided for programs requiring full process records.
Laser-assisted removal of existing solder balls avoids thermal stress to the package substrate.
Reballing pairs directly with our alloy conversion service where a full alloy change is required.
Every reballed component is inspected and documented before dispatch.
A cost-effective path for salvaging BGA components from rework or obsolete board recovery, rather than sourcing a full replacement.
BGA laser reballing is the process of removing worn or damaged solder balls from a Ball Grid Array package and replacing them with new, precision-placed balls of the correct alloy and pitch, using a laser to remove residual solder without thermal stress to the component.
We reball BGA packages with ball pitches from 0.4mm to 1.27mm, covering standard and fine-pitch devices. If your component falls outside this range, contact us with the package datasheet.
We offer SAC305 (lead-free), Sn63Pb37 (eutectic tin-lead), and low-temperature bismuth-tin alloys. Alloy selection is confirmed with you at the quoting stage.
Call us or email with your component part number, quantity, ball pitch, and required alloy if known, and we will respond with a written quotation.
Get in touch and our engineering team will get a quote back to you, usually within 24 hours.