ISI provides a comprehensive lead pre-forming service for most active or passive discrete components. Our experience and resources offer a capability with few limitations, achieving cost savings in tooling and higher efficiencies than in-house processing. The service can be performed on components supplied either loose or on tape.
From fully automatic to manual processing, covering extensive cropping and forming capabilities.
Active and passive component processing across axial, radial, SIL, and DIL packages.
Axial-to-radial lead forming, snap-in and stand-off forms, and manufacture of pressed parts to custom drawings.
Pairs directly with our axial and radial taping and SMD taping and reeling services for components moving straight to the next production stage.
Lead forming carried out to your specified pitch, stand-off height, and bend angle, with tooling available for non-standard footprints.
Axial, radial, SIL, and DIL packages accommodated across automotive, industrial, and general electronics applications.
Batch records maintained from incoming component through to formed and inspected output.
Engineering batches and full production runs handled without minimum order commitments.
Lead forming shapes the leads of electronic components so they seamlessly fit onto printed circuit boards. Leads usually come straight from the manufacturer and need to be precisely formed into a specific contour to align with the mounting holes on a PCB.
Yes. This service works well alongside our axial and radial taping and SMD taping and reeling services, with custom carrier tape available for components moving to the next stage.
Get in touch and our engineering team will get a quote back to you, usually within 24 hours.