ISI provides bare die tape and reel services for wafer-level CSP, WLCSP, flip chip, and die package devices. We take unpackaged semiconductor die from wafer, film frame, waffle pack, or loose format and place them into EIA-481-D compliant carrier tape, ready for direct SMT line-feed. Available standalone or combined with device programming, laser marking, and dry packing for a complete finishing solution.
Wafer (6", 8", and 12"), film frame, waffle pack, and loose die, processed through automated die handlers with integrated vision inspection.
0.5mm square to 12mm square, covering CSP, WLCSP, micro-BGA, bumped die, and flip chip packages.
Processing down to 60 micron thickness, with precision handling to prevent cracking or chipping of ultra-thin devices.
Film frame mount, wafer-to-tape-and-reel, waffle-pack-to-tape-and-reel, wafer-to-waffle-pack, defect inspection, and packaging and distribution.
Silicon, glass, ceramic, and FR4-based wafer-level devices all supported.
ESD, humidity, and temperature controlled production, with cleanroom processing available for devices requiring a protected environment.
Die and flip chip inspected for cracking, chipping, bump coplanarity, and orientation as part of the taping process.
All bare die processing is compliant to EIA-481-D throughout.
Complete documentation maintained for programs requiring full process records.
Bare die taping carried out alongside programming and marking on one site, reducing handling steps and lead time.
Bare die tape and reel is the process of taking unpackaged semiconductor die, supplied as diced wafer, waffle pack, or loose die, and placing them into carrier tape for automated SMT assembly, protecting fragile devices and enabling high-volume placement.
We accept bare die in wafer format (6", 8", and 12" on film frame), waffle pack, and loose die. Contact us with your format and we will confirm suitability before quoting.
We process die sizes from 0.5mm square to 12mm square, covering CSP, WLCSP, micro-BGA, bumped die, and flip chip packages, with a minimum die thickness of 60 microns.
Yes. Bare die tape and reel can be combined with device programming, laser marking, and dry packing in a single workflow at our Indianapolis facility.
Get in touch and our engineering team will get a quote back to you, usually within 24 hours.