ISI operates laser marking capability to meet customer delivery schedules for most IC devices, including SO, PLCC, QFP, and BGA packages. We also laser mark components outside the electronics industry where traceability is essential. Laser marking is often carried out alongside device programming or laser reballing, with alloy conversion available where required.
Marking suited to industries where full traceability matters, including date codes, lot numbers, and 2D matrix codes.
Ability to laser mark most IC devices across common package types.
Sample parts marked at no extra cost so customers can confirm mark quality before a production run.
Secure stock holding service for customers running call-off programs.
A non-contact laser process that leaves a lasting, chemical-resistant mark with no inks, labels, or adhesives that can degrade in service.
Marking applied to BGA, QFP, and other fine-pitch components where label or ink application is impractical.
Customer-specified content marked and recorded, with records maintained for audit.
Laser marking completed alongside programming and taping on one site, reducing handling and lead time.
Laser marking uses a concentrated laser beam to modify a material's surface, directed via a scanning mirror and focusing lens. Unlike ink-based methods, the marked surface resists wear so the imprint remains legible over time.
We mark most IC devices including SO, PLCC, QFP, and BGA packages, along with ceramic, plastic, and metal component packages more broadly. Contact us to confirm suitability for your part.
Get in touch and our engineering team will get a quote back to you, usually within 24 hours.